Researchers from the University of Colorado Boulder, University of Arizona, and Sandia National Laboratories have developed a new device that generates controlled vibrations on the surface of a microchip. These waves could help future smartphones become thinner, faster, and more efficient at handling wireless signals.
According to the research paper, they have developed a surface acoustic wave (SAW) phonon laser that can create “the tiniest earthquakes imaginable”. Instead of light, this laser sends mechanical waves that skim along the surface of a material.
Phones already rely on surface acoustic waves to clean up messy wireless signals, but it requires multiple components. This new approach aims to compress much of that work into a single, compact chip, freeing up space while improving performance.